Transmission Electron Microscopy in Semiconductors: Generating Ground Truth Insights

Written by Dominique Delille | Published: 08.14.2025

What is the current state of TEM in semiconductor analysis?

Transmission electron microscopy (TEM) has become a crucial tool in semiconductor manufacturing. Modern semiconductor fabrication requires atomic-scale imaging and analysis capabilities, particularly for complex three-dimensional (3D) structures, such as gate-all-around (GAA) logic transistors and 3D NAND memory channels.

How does TEM technology work?

TEM operates by directing an electron beam through an ultra-thin sample. The transmitted electrons interact with various filters, detectors, and cameras below the sample. Key operational aspects include:

Acceleration voltages—60 kV to 300 kV range for semiconductor applications
Resolution capability—down to individual atom visualization
Analysis modes—TEM and STEM (scanning TEM)

Diagram comparing optical microscope with light source and lenses to TEM with electron source and lenses

Fig 1: Comparison diagram of optical microscope and TEM configurations.

What are the key differences between TEM and STEM modes?

TEM mode:

Uses a focused beam on the sample
Captures transmitted electrons in a single snapshot
Employs high-speed, high-resolution cameras
Offers faster, simpler operation

Schematic of TEM mode operation displaying electron source, lenses, specimen holder, and viewing screen in sequence.

Fig 2: Schematic illustration of TEM mode operation.

STEM mode:

Utilizes electromagnetic scan coils
Scans a focused beam across the sample
Multiple detector configurations available
Provides flexible, high-contrast imaging

Schematic of STEM mode operation displaying electron source, lenses, scanning coils, specimen holder, detector, and viewing screen in sequence

Fig 3: Schematic illustration of STEM mode operation.

How has automation enhanced TEM analysis?

Modern semiconductor TEM systems feature significant automation improvements:

Simplified parameter selection
Automated alignment and calibration
Reduced data distortion risk
Atomic-scale image calibration
Streamlined operation for various sample types

Why is TEM critical for semiconductor manufacturing?

TEM serves as the primary source for reference data in semiconductor design and fabrication due to:

Increased 3D device complexity
Shrinking critical dimensions
EUV lithography requirements
Need for atomic interface analysis
Strain and magnetic field measurements

What are the key applications and the industry impact?

Leading semiconductor manufacturers now generate tens of thousands of TEM datasets monthly for:

Process variation analysis
Wafer fab tool calibration
Defect mechanism investigation
Quality control

Line graph depicting the increasing trend in semiconductor TEM analysis usage

Fig 4: Graph showing growth trend in semiconductor TEM analysis usage.

Summary

TEM technology provides atomic-level imaging and analysis capabilities
Dual-mode operation (TEM/STEM) offers flexible analysis options
Automation advances have simplified operation and improved reliability
Critical role in semiconductor manufacturing quality control
Essential for next-generation device development

Written by:

Dominique Delille

Senior Product Marketing Manager, Thermo Fisher Scientific

Dominique Delille is a Senior Product Marketing Manager with extensive experience in microscopy and analytical characterization for semiconductor applications. His background includes transmission electron microscopy (TEM) and related techniques used to study structure, composition, and performance of advanced semiconductor devices.

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