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Session 1: October 14, 10 a.m. ET, 4 p.m. CET
Session 2: October 15, 10 a.m. CST
See how gallium-free plasma-FIB supports cleaner compound semiconductor analysis and demonstrates sub-20 nm precision for advanced logic TEM preparation.
Gallium-containing devices are becoming increasingly relevant across technology segments, from power and RF applications to advanced logic. Gallium-based thin films, epitaxial stacks, and substrates are creating more sensitive interfaces with native gallium composition.
This webinar challenges assumptions about plasma-FIB based preparation of critical samples for TEM imaging with two application datasets: a GaN HEMT workflow showing why gallium-free preparation matters for gallium-containing compound semiconductors, and a 5 nm FinFET workflow demonstrating ultra-thin, structure-targeted lamella preparation.
In this session, we will show how multi-ion PFIB uses xenon and argon ion species to create clean TEM samples ready for accurate, high-resolution analysis.
Join us to learn:
Who should attend
Semiconductor researchers, FA engineers, TEM and FIB users, process development teams, and characterization labs working with compound semiconductors, power and RF devices, advanced logic, FinFETs, or interface-sensitive analysis.
Register now to see the data behind gallium-free PFIB TEM preparation.
Adam Stokes is a product marketing manager of plasma focused ion beam (PFIB) and laser products for semiconductor-based applications at Thermo Fisher Scientific. Before his current role, Adam specialized in plasma FIB applications for materials science with Thermo Fisher. Prior to Thermo Fisher, Adam worked at the National Renewable Energy Laboratory for 6 years specializing in electron microscopy and photovoltaics device physics. Adam received his PhD in Materials Science from the Colorado School of Mines in 2016. His areas of expertise include plasma source and liquid metal ion source FIB, (scanning) transmission electron microscopy, and atom probe tomography.