Search
Search
View additional product information for Copper etchant - FAQs (044583.LV, 044583.R0)
5 product FAQs found
Copper etchant has an etch rate of 1 mil/minute at 40 degrees C (etches 1 oz copper in 90 seconds).
Undercutting of the etchant can be reduced by increasing the rate of stirring or agitation.
No, it is a ready-to-use solution. Dilution will only be necessary if you want to reduce the etch rate.
The etch rate of the etchant can be reduced by adding 1 part deionized water to 2 parts etchant. This will reduce the etch rate approximately 50%.
The etch rate of the etchant will be increased by increasing the rate of stirring or agitation.