Summer Failure Analysis Workshop | Thermo Fisher Scientific

June 27, 2024, 12:30 p.m. – 8:00 p.m., Amari SPICE Penang Hotel, Malaysia

July 11, 2024, 12:30 p.m. – 5:45 p.m., Sheraton Hsinchu Hotel, Taiwan

Join us for an exclusive opportunity to learn about the latest developments and trends in semiconductor defect analysis and metrology. Our workshop is designed to provide attendees with valuable insights into the world of semiconductor failure analysis.

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June 27, 2024, 12:30 p.m. – 8:00 p.m., Amari SPICE Penang Hotel, Malaysia

July 11, 2024, 12:30 p.m. – 5:45 p.m., Sheraton Hsinchu Hotel, Taiwan

During the Summer Failure Analysis Workshop, you will have the chance to network with industry experts and peers, allowing you to explore potential collaborations, build connections and engage in discussions with experts from Thermo Fisher Scientific.

Don't miss out on this unique opportunity to expand your knowledge, connect with industry professionals, and stay up-to-date with the latest advancements in semiconductor defect analysis and metrology.

Attend the Summer Failure Analysis Workshop to learn more about:

Electrical fault localization
Defect characterization
Physical and chemical analysis
FIB-SEM DualBeam analysis
S/TEM analysis
SEM analysis
Metrology

Agenda for Penang, Malaysia, June 27
Agenda for Hsinchu, Taiwan, July 11

Location: Amari SPICE Penang Hotel, Malaysia

Thursday, 27th of June 2024

12:30 p.m. - 8:00 p.m. Malaysia Time

Time

Duration

Topic

12:30 p.m. - 12:45 p.m.

15

Registration

12:45 p.m. - 1:00 p.m.

15

Opening & Introduction

1:00 p.m. - 1:15 p.m.

15

Phenom Pharos Desktop FESEM and Its Application in Semiconductors*

1:15 p.m. - 2:00 p.m.

45

Fault localization techniques for advanced packaging and power semiconductor devices

2:00 p.m. - 2:45 p.m.

45

Ga-free FIB workflows to accelerate packaged die failure analysis

2:45 p.m. - 3:15 p.m.

30

Tea break

3:15 p.m. - 3:45 p.m.

30

Advanced Packaging: Wafer-Level Defect Analysis and Metrology

3:45 p.m. - 4:15 p.m.

30

Talos F200E: Lab-based S/TEM Solution for Advanced Semiconductor Analysis and Research

4:15 p.m. - 4:45 p.m.

30

The XPS surface analysis for the semiconductor failure analysis &

Automated particle analysis on the Desktop SEM for cleanliness analysis

4:45 p.m. - 5:15 p.m.

30

Semiconductor Visualization and Data Solutions (Avizo)

5:15 p.m. - 6:00 p.m. 45 Closing & Free Live Demo of Phenom Pharos Desktop SEM
6:00 p.m. - 8:00 p.m.

120

Networking Dinner

* Customers are welcome to bring their own samples for a live demonstration on our Thermo Scientific Phenom Pharos Desktop SEM during the workshop.

Location: Sheraton Hsinchu Hotel, Taiwan

Thursday, 11th of July 2024

12:30 p.m. - 5:45 p.m. China Standard Time

Time

Duration

Topic

12:30 p.m. - 12:45 p.m.

15

Registration

12:45 p.m. - 1:00 p.m.

15

Opening & Introduction

1:00 p.m. - 1:45 p.m.

45

Fault localization techniques for advanced packaging and power semiconductor devices

1:45 p.m. - 2:15 p.m.

30

Introducing the Thermo Scientific Helios FIB-SEM Family and the Advanced Automation Workflow

2:15 p.m. - 2:35 p.m.

20

Remote demo - Axia ChemiSEM Scanning Electron Microscope and automated in-situ quantitative EDS mapping

2:35 p.m. - 3:05 p.m.

30

Tea break

3:05 p.m. - 3:50 p.m.

45

Ga-free FIB workflows to accelerate packaged die failure analysis

3:50 p.m. - 4:20 p.m.

30

Advanced Packaging: Wafer-Level Defect Analysis and Metrology

4:20 p.m. - 4:50 p.m.

30

Talos F200E: Lab-based S/TEM Solution for Advanced Semiconductor Analysis and Research

4:50 p.m. - 5:10 p.m.

20

The XPS surface analysis for the semiconductor failure analysis

5:10 p.m. - 5:30 p.m. 20 Semiconductor Visualization and Data Solutions (Avizo)
5:30 p.m. - 5:45 p.m.

15

Closing

Time	Duration	Topic
12:30 p.m. - 12:45 p.m.	15	Registration
12:45 p.m. - 1:00 p.m.	15	Opening & Introduction
1:00 p.m. - 1:15 p.m.	15	Phenom Pharos Desktop FESEM and Its Application in Semiconductors*
1:15 p.m. - 2:00 p.m.	45	Fault localization techniques for advanced packaging and power semiconductor devices
2:00 p.m. - 2:45 p.m.	45	Ga-free FIB workflows to accelerate packaged die failure analysis
2:45 p.m. - 3:15 p.m.	30	Tea break
3:15 p.m. - 3:45 p.m.	30	Advanced Packaging: Wafer-Level Defect Analysis and Metrology
3:45 p.m. - 4:15 p.m.	30	Talos F200E: Lab-based S/TEM Solution for Advanced Semiconductor Analysis and Research
4:15 p.m. - 4:45 p.m.	30	The XPS surface analysis for the semiconductor failure analysis & Automated particle analysis on the Desktop SEM for cleanliness analysis
4:45 p.m. - 5:15 p.m.	30	Semiconductor Visualization and Data Solutions (Avizo)
5:15 p.m. - 6:00 p.m.	45	Closing & Free Live Demo of Phenom Pharos Desktop SEM
6:00 p.m. - 8:00 p.m.	120	Networking Dinner