Join us at SEMICON China 2019

No other company can match our breadth of knowledge and depth of technology

Thermo Fisher Scientific has proven technology for the industry roadmap from advanced FinFET logic to 3D NAND to display. We are the only provider with complete analysis solutions available for every phase of the product lifecycle:

• Design verification
  Using physical and electrical analysis techniques to aid in design verification, electrical circuit analysis testing and modification. Relevant techniques include circuit edit, optical fault isolation and compliance testing solutions (ESD).
• Electrical analysis
  Electrical fault isolation and electrical failure analysis. Relevant techniques include thermal fault isolation, optical fault isolation and nanoprobing for fault isolation and transistor characterization.
• Physical and elemental analysis
  Physical analysis of semiconductor structures to understand physical, elemental or structural information. Relevant techniques include SEM, TEM, EDS, XPS and Raman/FTIR analysis.
• Yield enhancement and process control
  Production support for high-volume wafer fabrication. Relevant techniques include SEM, TEM, EDS for yield enhancement and process control and ICPMS for inline chemical quality control.
• Incoming quality control
  Analysis of incoming materials to prevent contamination of clean room air, ultra-pure water, process gases and chemicals to minimize wafer yield loss. Relevant techniques include ion chromatography, gas chromatography and trace element analysis.