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Semiconductor Metrology Equipment Webinar
Metrology equipment for semiconductor yield improvement.
Increasing memory capacity to meet bit demand without sacrificing yield can be challenging. Vertical stacking of memory, such as 3D NAND, is dependent on etching process precision to leverage higher aspect ratios, while deposition consistency can be difficult. As aspect ratios increase, FAB and lab memory FA engineers and managers are faced with more complex challenges. These include:
- Measuring and analyzing more complex vertical stacks and very high aspect ratio (HAR) structures in current memory devices, like 3D NAND.
- Accessing hard-to-reach sites or regions of interest buried deep within the vertical stack.
- Reducing fault analysis time with faster time-to-data, to optimize fab output.
Outsourcing to external labs isn't the answer for the fab to optimize time-to-market.
For 3D NAND, DRAM, and advanced memory manufacturers wanting to decrease cost per wafer, FAB FA engineers can’t afford to rely on slow analysis turnaround. Instead, they need metrology systems within the fab environment itself, as well as tools that provide the capabilities and performance that fabs need.
What will you learn in this webinar
- About the high-performance capabilities of this new product.
- That it’s possible to do structural measurements in the vertical direction per layer.
- How you can identify defects and process extrusions at each stage.
- How to reduce your time-to-data, sample turnaround time, process development cycles, and time-to-market.
Who should attend this webinar
This webinar is for anyone who wants to learn how they can get faster time-to-data for through-stack metrology. This includes:
- 3D NAND, DRAM, and advanced memory manufacturers.
- Memory FA managers and engineers.
About the Semiconductor SPARK Webinar Series
Save time, save money, and stay on top of semiconductor technology advancement at SPARK, a knowledge platform from Thermo Fisher Scientific.
SPARK is a collaborative space where industry thought leaders provide their perspective on tool performance and best practices. SPARK establishes a community for professionals who want to easily access actionable semiconductor and microelectronics insights, and gain visibility to state-of-the-art solutions. This includes the latest updates on Thermo Fisher Scientific’s semiconductor products and workflows.
About the speaker:
David Tien, Product Marketing Director, Thermo Fisher Scientific
David Tien is a Product Marketing Director at Thermo Fisher and previously managed the Circuit Edit and ELITE product lines in the Electrical Fault Analysis Group. His experience in the semiconductor industry spans over two decades with experience in not only electrical failure analysis but also in the areas of process development and process control and diagnostics. During this time, he has also authored over 15 technical publications and patents. David holds a bachelor’s degree in Chemical Engineering from UC Berkeley and an MBA from California State University.