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Innovative failure analysis solutions for advanced packaging
As semiconductor technology advances, the demand for high-performance, power-efficient, and miniaturized devices is rapidly growing. Advanced packaging technologies, such as 2.5D, 3D integration, wafer-level packaging (WLP), and heterogeneous integration, play a crucial role in enabling these innovations. However, as packaging structures become more complex, new reliability challenges and failure mechanisms emerge, necessitating sophisticated failure analysis (FA) methodologies. FA is critical for identifying defects, improving yield, ensuring product reliability, and reducing time-to-market for semiconductor manufacturers.
Explore our comprehensive FA solutions
Our white paper delves into the evolving landscape of FA in advanced packaging, detailing the most common failure mechanisms, including interconnect degradation, delamination, electromigration, and thermal-induced stress. We examine innovative FA techniques, both non-destructive and destructive, such as X-ray computed tomography (XCT), scanning acoustic microscopy (SAM), lock-in thermography (LIT), focused ion beam (FIB) analysis, and transmission electron microscopy (TEM).
Key technologies in advanced packaging:
Challenges and solutions
Despite advancements in FA tools, the miniaturization of semiconductor devices presents new challenges, such as limited accessibility to buried interconnects, complex material interactions, and increased failure mode variability. The industry is responding by developing real-time monitoring techniques, high-resolution imaging solutions, and advanced simulation models to enhance reliability assessments.
Our integrated FA workflow
By organizing innovative tools into a cohesive workflow, we set a remarkable standard for failure analysis in the advanced packaging industry. This integrated approach enhances the accuracy and efficiency of defect identification and characterization, accelerating the development and optimization of packaging technologies. Our workflow includes:
White paper: Innovative failure analysis solutions for advanced packaging
Through case studies and industry insights, our white paper highlights the best practices for FA in advanced packaging, and it outlines future directions for the field. As semiconductor packaging continues to evolve, a proactive approach to FA will be essential for ensuring product quality, optimizing manufacturing processes, and driving innovation in next-generation electronic devices.
Download our white paper to learn more about our innovative FA solutions and how they can help you stay ahead in the rapidly evolving semiconductor industry.