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Demand for high-performance power MOSFETs is growing as manufacturers of consumer electronics, electric vehicles, and many other devices require improved power management solutions. Higher voltages and frequencies, and integrating new materials into existing processes can bring new product quality and reliability challenges.
To address these challenges, power device vendors need tools that quickly provide fault localization information to improve product quality and reliability.
Watch our on-demand webinar to learn how a new electrical failure analysis (EFA) to physical failure analysis (PFA) workflow can help you precisely identify the location of defects and take quick action to minimize yield issues.
You will learn:
Failure analysis engineers, facilities managers, and fab managers in the semiconductor industry.
Billy Tang is a failure analysis manager with more than 13 years of experience working with semiconductor labs. He has served as senior application specialist for nanoprobing applications in China and as sales development manager in charge of EFA product business development. Billy earned his bachelor’s degree in material and physics at Shanghai University.
Neel Leslie, Application Engineer Manager, Thermo Fisher Scientific
Neel Leslie is an application engineer manager who develops and implements new applications and workflows to address systematic yield problems during electrical testing. Neel has been with the company since 2012, starting at FEI as a development engineer. Prior to joining Thermo Fisher Scientific, he worked as a clinical microbiology research intern at the UC Davis Medical Center.


