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Date: 26 June 2025
Conference time: 9 a.m. to 6 p.m. UTC +8
Location: Marriott Tang Plaza, Singapore
At SPARK Singapore 2025, we will demonstrate how beneficial our latest advanced Thermo Scientific instruments and their use cases can be to your business, including the ELITE+ System, the nProber System, compliance test solutions, the Helios 6 HD FIB-SEM, and the Spectra (S)TEM with EELS analysis. Discover groundbreaking advancements in materials science and semiconductor failure analysis solutions and learn about our specialized analytical workflow solutions tailored for memory, compound power, and advanced packaged device applications.
Experience how our electrical and physical failure analysis solutions empower you to evaluate the defects, perform precise metrology, and uncover buried defects in even the most challenging semiconductor devices.
[Bonus] Bring your samples for a FREE live demo of the Thermo Scientific Phenom Desktop SEM during SPARK Singapore. Our experts will assist you in discovering the capabilities of this compact and user-friendly system. Don’t miss this opportunity!
| Start | End | Min | Topic |
9:00 a.m. |
9:45 a.m. |
45 | Registration & Networking |
9:45 a.m. |
10 a.m. |
15 | Opening Speech |
10:00 a.m. |
10:30 a.m. |
30 | ELITE System Innovations: Transforming FA with Next-Gen Features |
10:30 a.m. |
11:00 a.m. |
30 | The Evolution from Optical Fault Inspection to E-Beam Probing |
11:00 a.m. |
11:30 a.m. |
30 | Innovative Backside Analysis with the nProber System: Introduction and Use Case Highlights |
11:30 a.m. |
12:00 p.m. |
30 | Revolutionizing Failure Analysis with CTS: Tool Introduction and Practical Use Cases |
12:00 p.m. |
1:30 p.m. |
90 | Lunch Break |
1:30 p.m. |
2:00 p.m. |
30 | Applications of Phenom Desktop SEM |
2:00 p.m. |
2:30 p.m. |
30 | Helios 6 HD FIB-SEM: Advanced FIB-SEM for High-Resolution Semiconductor Analysis |
2:30 p.m. |
3:15 p.m. |
45 | Next-gen High-throughput XPS for Semiconductor Surface Analysis |
3:15 p.m. |
3:45 p.m. |
30 | The Latest Updates of Helios 5 Plasma FIB and Applications |
| 3:45 p.m. | 4:15 p.m. | 30 | Tea break |
| 4:15 p.m. | 5:00 p.m. | 45 | Spectra (S)TEM with EELS: Ultimate Solution to the R&D Challenges in Semiconductor Industry |
| 5:00 p.m. | 5:30 p.m. | 30 | The Next Generation of Multi-Modality Image Analysis Solution: AI and Machine Learning Evolution |
| 5:30 p.m. | 6:00 p.m. | 30 | Case study of Advanced Packaging Device and Power Semi |
| 6:00 p.m. | 8:00 p.m. | 120 | Networking dinner |