The need for a more connected, more autonomous, and smarter world drives innovation in semiconductor and microelectronic devices, which require consistent improvements in performance, energy efficiency, security, cost, and reliability. Focus must also be given to improving time-to-market and time-to-yield. However, shrinking geometries, new materials, and novel 3D architectures make these continual improvements increasingly more challenging. As a result, current 2D metrology and inspection workflows are no longer adequate for device manufacturing. Instead, high-productivity 3D analysis workflows are now essential to the fabrication process.

Overall, these 3D analysis tools and workflows give manufacturers the ability to provide high-productivity characterization of a broad range of devices. This includes equipment for ESD compliance testing, efficient pathfinding, advanced imaging and analysis, layer-by-layer device de-processing, laser ablation, and for maximizing yield in the shortest time possible.

Thermo Fisher Scientific provides the broadest portfolio of high-productivity 3D analysis workflows that accelerate development, maximize yields, and ensure the production of high-quality devices that meet current and future industry demands. Explore the pages below to learn how our applications and workflows can address your specific needs.


Resources

Applications

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Semiconductor Pathfinding and Development

Advanced electron microscopy, focused ion beam, and associated analytical techniques for identifying viable solutions and design methods for the fabrication of high-performance semiconductor devices.

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Yield Ramp and Metrology

We offer advanced analytical capabilities for defect analysis, metrology, and process control, designed to help increase productivity and improve yield across a range of semiconductor applications and devices.

Semiconductor Failure Analysis

Semiconductor Failure Analysis

Increasingly complex semiconductor device structures result in more places for failure-inducing defects to hide. Our next-generation workflows help you localize and characterize subtle electrical issues that affect yield, performance, and reliability.

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Physical and Chemical Characterization

Ongoing consumer demand drives the creation of smaller, faster, and cheaper electronic devices. Their production relies on high-productivity instruments and workflows that image, analyze, and characterize a broad range of semiconductor and display devices.

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ESD Semiconductor Qualification

Every electrostatic discharge (ESD) control plan is required to identify devices that are sensitive to ESD. We offer a complete suite of test systems to help with your device qualification requirements.

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Advanced Memory Technology

Modern data demands are driving innovation in 3D NAND, DRAM and other memory structures. Our memory analysis tools and workflows offer high-productivity characterization so that manufacturers can meet performance, latency, and capacity demands.

Power Semiconductor Device Analysis

Power Semiconductor Device Analysis

Power devices pose unique challenges for localizing faults, primarily as a result of power device architecture and layout. Our power device analysis tools and workflows quickly pinpoint fault locations at operating conditions and provide precise, high-throughput analysis for characterization of materials, interfaces and device structures.

Display Module Failure Analysis

Display Module Failure Analysis

Evolving display technologies aim to improve display quality and light conversion efficiency to support applications in different industry sectors, while continuing to reduce production costs. Our process metrology, failure analysis and research and development solutions help display companies solve these challenges.

Style Sheet for Komodo Tabs

Techniques

TEM 计量

先进的自动化 TEM 计量程序的精确度比手动方法高得多。这样用户可以生成大量具有亚埃级特异性的统计相关数据、而不存在操作员偏差。

了解更多 ›

半导体 TEM 成像和分析

赛默飞世尔科技透射电镜可对半导体器件进行高分辨率成像和分析,使制造商能够校准工具集、诊断故障机制并优化整体流程产量。

了解更多 ›

电路编辑

先进的专用电路编辑和纳米原型设计解决方案将新型气体输送系统与广泛的化学品组合和聚焦离子束技术相结合,为半导体器件开发提供无与伦比的控制和精确度。

了解更多 ›

SEM 计量

扫描电子显微镜可以纳米尺度提供准确可靠的计量数据。自动化的超高分辨率 SEM 计加快了内存、逻辑和数据存储应用的利润产出时间和上市时间。

了解更多 ›

半导体分析和成像

赛默飞世尔科技提供适合半导体实验室每个功能的扫描电子显微镜,从一般成像任务到高级故障分析技术,都需要精确的电压对比测量。

了解更多 ›

光学故障隔离

半导体制造中越来越复杂的设计使故障和缺陷隔离变得越来越复杂。光学故障隔离技术使您可以分析电活性设备的性能,以定位导致设备故障的关键缺陷。

了解更多 ›

热故障隔离

本地功率耗散分布不均匀可能导致较大的局部温度上升,从而导致设备故障。我们提供采用高灵敏度锁定红外热成像 (LIT) 技术进行热故障隔离的独特解决方案。

了解更多 ›

半导体器件的样品制备

Thermo Scientific DualBeam 系统为半导体器件的原子尺度分析提供了准确的 TEM 样品制备。自动化和先进的机器学习技术可以在正确的位置生成高质量的样品,并且单位样品成本低。

了解更多 ›

纳米探针

随着设备复杂性的增加,隐藏缺陷的位置数量也随之增加。纳米探针可提供电气故障的精确定位、这对于有效的透射电镜故障分析工作流程至关重要。

了解更多 ›

APT 样品制备

原子探针断层扫描 (APT) 提供材料的原子分辨率 3D 组成分析。聚焦离子束 (FIB) 显微镜是一项为 APT 表征进行高质量、定向和特定样品制备的基本技术。

了解更多 ›

半导体激光烧蚀

激光烧蚀可为半导体器件提供高通量减薄,以便在保持样品完整性的同时使用电子显微镜进行成像和分析。访问大容量 3D 数据并优化减薄条件,从而完美匹配您的样品类型。

了解更多 ›

器件扁平化

逐渐缩小的尺寸配以先进的设计和结构,导致半导体的故障分析变得越来越具有挑战性。器件无损扁平化是检测埋藏的电气故障和故障的关键技术。

了解更多 ›

ESD 合规性测试

静电放电 (ESD) 会损坏半导体和集成电路中的小功能和结构。我们提供一套全面的测试设备、用以验证您的设备是否符合目标 ESD 合规标准。

了解更多 ›

TEM 计量

先进的自动化 TEM 计量程序的精确度比手动方法高得多。这样用户可以生成大量具有亚埃级特异性的统计相关数据、而不存在操作员偏差。

了解更多 ›

半导体 TEM 成像和分析

赛默飞世尔科技透射电镜可对半导体器件进行高分辨率成像和分析,使制造商能够校准工具集、诊断故障机制并优化整体流程产量。

了解更多 ›

电路编辑

先进的专用电路编辑和纳米原型设计解决方案将新型气体输送系统与广泛的化学品组合和聚焦离子束技术相结合,为半导体器件开发提供无与伦比的控制和精确度。

了解更多 ›

SEM 计量

扫描电子显微镜可以纳米尺度提供准确可靠的计量数据。自动化的超高分辨率 SEM 计加快了内存、逻辑和数据存储应用的利润产出时间和上市时间。

了解更多 ›

半导体分析和成像

赛默飞世尔科技提供适合半导体实验室每个功能的扫描电子显微镜,从一般成像任务到高级故障分析技术,都需要精确的电压对比测量。

了解更多 ›

光学故障隔离

半导体制造中越来越复杂的设计使故障和缺陷隔离变得越来越复杂。光学故障隔离技术使您可以分析电活性设备的性能,以定位导致设备故障的关键缺陷。

了解更多 ›

热故障隔离

本地功率耗散分布不均匀可能导致较大的局部温度上升,从而导致设备故障。我们提供采用高灵敏度锁定红外热成像 (LIT) 技术进行热故障隔离的独特解决方案。

了解更多 ›

半导体器件的样品制备

Thermo Scientific DualBeam 系统为半导体器件的原子尺度分析提供了准确的 TEM 样品制备。自动化和先进的机器学习技术可以在正确的位置生成高质量的样品,并且单位样品成本低。

了解更多 ›

纳米探针

随着设备复杂性的增加,隐藏缺陷的位置数量也随之增加。纳米探针可提供电气故障的精确定位、这对于有效的透射电镜故障分析工作流程至关重要。

了解更多 ›

APT 样品制备

原子探针断层扫描 (APT) 提供材料的原子分辨率 3D 组成分析。聚焦离子束 (FIB) 显微镜是一项为 APT 表征进行高质量、定向和特定样品制备的基本技术。

了解更多 ›

半导体激光烧蚀

激光烧蚀可为半导体器件提供高通量减薄,以便在保持样品完整性的同时使用电子显微镜进行成像和分析。访问大容量 3D 数据并优化减薄条件,从而完美匹配您的样品类型。

了解更多 ›

器件扁平化

逐渐缩小的尺寸配以先进的设计和结构,导致半导体的故障分析变得越来越具有挑战性。器件无损扁平化是检测埋藏的电气故障和故障的关键技术。

了解更多 ›

ESD 合规性测试

静电放电 (ESD) 会损坏半导体和集成电路中的小功能和结构。我们提供一套全面的测试设备、用以验证您的设备是否符合目标 ESD 合规标准。

了解更多 ›

Samples


半导体材料和器件表征

随着半导体器件的缩小和变得越来越复杂、需要新的设计和结构。高生产率 3D 分析工作流程可以缩短器件开发时间、最大程度提高产量、并确保器件符合行业未来需求。

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Products

Style Sheet for Instrument Cards Original

Spectra 300

  • Highest-resolution structural and chemical information at the atomic level
  • Flexible high-tension range from 30-300 kV
  • Three lens condenser system

Spectra Ultra

  • New imaging and spectroscopy capabilities on the most beam sensitive materials
  • A leap forward in EDX detection with Ultra-X
  • Column designed to maintain sample integrity.

Helios 5 PFIB DualBeam

  • Gallium-free STEM and TEM sample preparation
  • Multi-modal subsurface and 3D information
  • Next-generation 2.5 μA xenon plasma FIB column

Helios 5 PXL PFIB Wafer DualBeam

  • PFIB beam current from 1pA–2.6µA
  • Faster yield learning and increased productivity
  • Automated handling of 300 mm FOUP with EFEM (GEM300 compliant

Helios 5 EXL DualBeam

  • Low-voltage performance for high sample preparation quality
  • Ultra-high-resolution immersion-lens field-emission SEM column
  • Automated handling of 300 mm FOUP with EFEM (GEM300 compliant)

Helios 5 DualBeam

  • Fully automated, high-quality, ultra-thin TEM sample preparation
  • High throughput, high resolution subsurface and 3D characterization
  • Rapid nanoprototyping capabilities

Talos F200E TEM

  • High-quality (S)TEM imaging of semiconductor and microelectronic devices
  • Precise, high-speed chemical characterization with EDS
  • Dedicated semiconductor-related applications

Metrios AX TEM

  • Automation options to support quality, consistency, metrology, and reduced OPEX
  • Leverages machine learning for superior autofunctions and feature recognition
  • Workflows for both in-situ and ex-situ lamella preparation

Scios 2 DualBeam

  • Full support of magnetic and non-conductive samples
  • High throughput subsurface and 3D characterization
  • Advanced ease of use and automation capabilities

ExSolve WTP DualBeam

  • Can prepare site-specific, 20 nm thick lamellae on whole wafers up to 300 mm in diameter
  • Addresses needs requiring automated, high-throughput sampling at advanced technology nodes

Verios 5 XHR SEM

  • Monochromated SEM for sub-nanometer resolution over the full 1 keV to 30 keV energy range
  • Easy access to beam landing energies as low as 20 eV
  • Excellent stability with piezo stage as standard

Quattro ESEM

  • Ultra-versatile high-resolution FEG SEM with unique environmental capability (ESEM)
  • Observe all information from all samples with simultaneous SE and BSE imaging in every mode of operation

Prisma E SEM

  • Entry-level SEM with excellent image quality
  • Easy and quick sample loading and navigation for multiple samples
  • Compatible with a wide range of materials thanks to dedicated vacuum modes

Apreo 2 SEM

  • High-performance SEM for all-round nanometer or sub-nanometer resolution
  • In-column T1 backscatter detector for sensitive, TV-rate materials contrast
  • Excellent performance at long working distance (10 mm)

VolumeScope 2 SEM

  • Isotropic 3D data from large volumes
  • High contrast and resolution in high and low vacuum modes
  • Simple switch between normal SEM use and serial block-face imaging

Phenom ProX G6 Desktop SEM

  • High performance desktop SEM with integrated EDS detector
  • Resolution <6 nm (SE) and <8 nm (BSE); magnification up to 350,000x
  • Optional SE detector

Taipan G2+ Circuit Edit System

  • Imaging and milling resolution to meet 10nm node specifications
  • Superb etch selectivity and deposition control for conductors and insulators
  • Excellent navigation and ion beam placement accuracy

Centrios CE

  • Superior image / milling resolution
  • Enhanced milling precision and control
  • Built on the Thermo Scientific Helios DualBeam platform

MK.4TE ESD and Latch-Up Test System

  • Rapid-relay-based operations—up to 2304 channels
  • Advanced device preconditioning with six separate vector drive levels
  • Fully compliant Latch-Up stimulus and device biasing

ELITE System

  • Completely non-destructive
  • Quickly identifies defective component on assembly board for accurate dispositioning
  • Localizes defect in x-y with micrometer accuracy, with depth location accurate to 20 µm

nProber IV

  • Localize transistor and BEOL faults
  • Thermal nanoprobing (-40°C to 150°C)
  • Semi-automated operation

Hyperion II System

  • Atomic Force Probing
  • Localize transistor faults
  • Integrated PicoCurrent (CAFM)

Meridian S System

  • Fault Diagnostic with Active Probe Technology
  • Static laser stimulation (SLS / OBIRCH) and photon emission options
  • Supports both micro-probing and probe card device stimulation

Meridian WS-DP System

  • High-sensitivity, low-noise, low-voltage photon emission detection with broadband DBX or InGaAs camera systems
  • Multi-wavelength laser scanning microscope for scan chain analysis, frequency mapping, transistor probing and isolation of faults

Meridian 7 System

  • Dynamic Optical Fault Isolation for 10nm node and below
  • High resolution visible and Infrared light
  • High-yield sample preparation to 5μm widely available

Meridian IV System

  • High sensitivity extended-wavelength DBX photon emission detection
  • Standard InGaAs photon emission detection
  • Laser Scanning Microscope with multiple wavelength options

Celestron Test System

  • Wafer and package level TLP testing
  • High current TLP pulse generato
  • Can be interfaced with semiautomatic probers
  • Intuitive software for control and report generation

Orion3 Test System

  • Charged device model testing
  • Dual high resolution color cameras
  • Test densities to less than 0.4mm pitch

Pegasus

  • Testing per the latest industry standards
  • True system level ESD 150pF/330Ω network
  • 2 pin connection via wafer probes to any device

AutoTEM 5

  • Fully automated in situ S/TEM sample preparation
  • Support of top-down, planar and inverted geometry
  • Highly configurable workflow
  • Easy to use, intuitive user interface

Auto Slice and View 4.0 Software

  • Automated serial sectioning for DualBeam
  • Multi-modal data acquisition (SEM, EDS, EBSD)
  • On-the-fly editing capabilities
  • Edge based cut placement

Maps Software

  • Acquire high-resolution images over large areas
  • Easily find regions of interest
  • Automate image acquisition process
  • Correlate data from different sources

Avizo Software
Materials Science

  • Support for multi-data/multi-view, multi-channel, time series, very large data
  • Advanced multi-mode 2D/3D automatic registration
  • Artifact reduction algorithms

iFast Software

  • Macro recorder for faster recipe creating
  • Runner for unattended overnight operation
  • Alignment tools: Image recognition and edge finding

Inspect 3D Software

  • Image processing tools and filters for cross-correlation
  • Feature tracking for image alignment
  • Algebraic reconstruction technique for iterative projection comparison

NEXS Software

  • Auto-syncs position/magnification between NEXS and Circuit Edit system for a more seamless user experience
  • Connects to most Thermo Scientific tools used for EFA, PFA and Circuit Edit space

AutoScript 4

  • improved reproducibility and accuracy
  • Unattended, high throughput imaging and patterning
  • Supported by Python 3.5-based scripting environment

Contact us

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用于材料科学的
半导体

为实现理想的系统性能,我们为您提供了由现场服务专家、技术支持部门和认证备件组成的全球网络支持。

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