Gold plating solution, electroless, metal content≈3.7g/L - FAQs

How should I prepare the surface of nickel or copper for gold plating with Gold plating solution, electroless, metal content≈3.7g/L?

Prior to plating, we recommend that you thoroughly clean the surface of the object to be plated. First, use a brush and a mild detergent to scrub the surface and then rinse thoroughly with purified water. Next, use a dilute hydrochloric (HCl) acid solution to remove any surface oxides and rinse thoroughly with purified water.

What instructions should I use for the Gold plating solution, electroless, metal content≈3.7g/L?

The gold plating solution can be kept in a glass beaker directly heated on a hot plate. The pH can drop with use, and we recommend adjusting the pH to the optimal range by adding small amounts of concentrated ammonium hydroxide.

What is the coverage of the Gold plating solution, electroless, metal content≈3.7g/L?

Assuming 50% of the gold is used, the coverage will be approximately 4096 cm²/L (635 in²/L or 2400 in²/gal) for an average thickness of 5 microinches of gold.

What is the deposition rate for the Gold plating solution, electroless, metal content≈3.7g/L?

The deposition rate for the Gold plating solution, electroless, metal content≈3.7g/L is 0.2-0.3 microinches/minute for a maximum thickness of 7-8 microinches in 30 minutes at 160°F (71°C). The thickness of gold can be increased to up to 15 microinches at a higher temperature of 175°F (80°C).

What are the operating conditions for the Gold plating solution, electroless, metal content≈3.7g/L?

The operating conditions for the Gold plating solution, electroless, metal content≈3.7 g/L are as follows:

• pH 5.0-5.5
• Agitation preferred
• Time: at least 15 minutes
• Temperature: 60-71°C (140-160°F)