Nickel etchant for electrodeposited nickel films - FAQs

Nickel etchant for electrodeposited nickel films has an etch rate of 50 Å/second at 40 degrees C.

Undercutting of the etchant can be reduced by increasing the rate of stirring or agitation.

No, it is a ready-to-use solution. Dilution will only be necessary if you want to reduce the etch rate.

The etch rate of the etchant can be reduced by adding 1 part deionized water to 2 parts etchant. This will reduce the etch rate approximately 50%.

The etch rate of the etchant will be increased by increasing the rate of stirring or agitation.