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Workflows for multi-scale analyses
Our DualBeam FIB-SEM systems empower a variety of advanced techniques that enable researchers and engineers to prepare samples and gather data in ways not possible with conventional microscopes. This page highlights the core techniques and workflows facilitated by our instruments, explaining what they are and why they matter for your objectives.
Correlative microscopy for multi-scale materials with laser-assisted FIB-SEM
As materials systems become increasingly complex, combining heterogeneous phases, engineered microstructures, and hierarchical architectures, comprehensive characterization requires coordinated analysis across multiple length scales and modalities. Correlative microscopy workflows integrate techniques such as micro X-ray computed tomography (µCT) to address features at millimeter scale, FIB-SEM serial sectioning combined with EBSD and EDS to analyze features at micrometer scale, and finally TEM to investigate materials at the nanometer size. The Thermo Scientific Helios Laser and Helios Hydra/PFIB Laser Systems uniquely combine a femtosecond laser with either gallium or a plasma FIB and high-resolution SEM, enabling rapid access to buried features and seamless correlation between macro-, micro-, and nanoscale datasets. By bridging millimeter-scale tomography with nanometer-resolution analytics, Helios Laser Systems are the essential part of the correlative workflows that accelerate structural and compositional analysis, helping to advance materials discovery and research.
Extra-large volume 3D FIB-SEM tomography for complex microstructures
Characterizing bulk materials and engineered components often requires volumetric analysis well beyond the limits of conventional Ga or PFIB systems. Laser-enabled plasma FIB technology expands automated serial sectioning and 3D tomography from tens of microns to millimeter-scale volumes while maintaining nanometer-scale resolution. The integrated femtosecond laser in the Thermo Scientific Helios Laser Hydra and Helios 5 Laser PFIB Systems enables rapid, athermal material removal with minimal heat-affected zones, dramatically increasing slice rates and accessible sample volumes. This capability supports large-volume 3D EBSD, 3D EDS, and multimodal tomography workflows for comprehensive structural, crystallographic, and chemical analysis. For researchers investigating additive manufacturing, structural alloys, energy materials, and other advanced systems, extra-large volume 3D tomography delivers the speed, scale, and data richness required to fully reconstruct and understand complex microstructures.
Techniques
| (S)TEM sample preparation | Combination of laser and PFIB or Ga FIB opens new opportunities for lamella fabrication. Laser allows to remove large volumes of material and target areas of interest that are buried deep under the surface, while sample is prepared in a conventional way using Ga or PFIB. Additionally, laser can be used for faster lift-outs of ultra-large chunks. |
| 3D structural analysis | Advanced speed for millimeter-scale tomography. Setup allows the use of the laser to sequentially remove thin slices of material followed by SEM imaging, or EDS/EBSD map acquisition, thus collecting datasets to be used for 3D reconstructions in Avizo Software. |
| Cross-sectioning (2D) | Extremely fast for massive cross-sections (e.g., through full electronic packages). Surfaces are often ready for SEM/EDS/EBSD examination directly after laser ablation. Well suited for charging and beam sensitive materials. |
| Nanoprototyping & nanofabrication | Nanofabrication and prototyping is enabled by the Ga or PFIB ion beams. Laser can be used for fabrication of large structures, such as samples for micro-mechanical testing. |
| Cryo workflow | Not directly applicable. Cryo workflows remain PFIB/FIB-based after bulk material removal. |
| APT tip preparation | Laser accelerates sample access, while tip preparation including final shaping relies on PFIB or Ga FIB. |
For Research Use Only. Not for use in diagnostic procedures.