Search
Advancing automation, precision, and productivity of semiconductor TEM preparation
The Thermo Scientific Helios 6 HX FIB-SEM provides top-tier automation and accuracy for high-volume semiconductor TEM preparation through several advancements. It features automated navigation and precise positioning for TEM preparation site setup, along with automated thinning enhanced by machine learning-assisted endpointing. Additionally, it includes AI training capability for fine-tuning and refining automation models to specific device types.
Equipped with innovative hardware and Thermo Scientific AutoTEM 6 Professional Software, the Helios 6 HX FIB-SEM enables fully automated TEM sample preparation, capable of producing sub-20 nm thin lamella with production-grade accuracy. Thermo Fisher Scientific collaborates closely with customers to meet the increasing demand for high-quality TEM sample preparation, keeping pace with advancements in semiconductor technology.
Precise FIB SEM sample preparation for metrology
Proven on a selected group of devices, the automated workflow offers sub-nanometer targeting accuracy for TEM lamella below 20 nm enabled by AI-powered and-pointing techniques, the new Osprey FIB column, and the new fully digital scanning and defection engine. The new engine provides improved cut placement accuracy for FIB activities, with rotational accuracy improved by 10× times compared to its predecessor. Improved orthogonality and magnification consistency for both FIB and SEM systems is also realized.
Robust FIB SEM workflow accuracy
Proven on a selected group of devices, the Helios 6 HX FIB-SEM offers more than 95% robustness for the automated Weld-To-Grid workflow and over 90% robustness for the fully automated thinning workflow to the target thickness. This impressive improvement in automation workflow robustness is attributed to several hardware and software innovations. These include the highly stable Osprey FIB column optimized for low-KV performance, fully automated FIB alignment required for automation workflows, a new Dual Lamella Carrier Holder with improved stability and flipping accuracy, a new Thermo Scientific MultiChem Gas Deposition System with enhanced stability, and the new Thermo Scientific EasyLift NanoManipulator.
Graph highlighting lamella output performance.
Perform Instrument Service and Support Program from Thermo Fisher Scientific
Thermo Scientific Perform Services will empower your success for the lifetime of your system. Simplify your budget and maximize availability with the extraordinary value and predictable cost of ownership provided by Thermo Fisher Scientific.
- Gain access to technical support and factory expertise with telephone support and RAPID remote diagnostics
- Keep systems in peak condition with the latest software updates, including licenses and installation
- Get Thermo Scientific quality parts expedited to your site from strategic global inventories
- Ensure a rapid response with priority access to Thermo Fisher Scientific engineers
- Experience optimized system function with regular preventive maintenance
Most of the Thermo Scientific Perform Service packages offer software updates and continuous access to Thermo Scientific RAPID remote service and telephone support, ensuring that our technical experts' assistance is always at your disposal. Options for consumables coverage, extended service hours, and targeted uptime can provide additional business-critical support.
Remote service for Thermo Scientific instruments
At Thermo Fisher Scientific, our digital capabilities allow us to be more agile and proactive in how we support your instrument. Leveraging data and remote technologies enables us to expand our service reach, deliver an accelerated response, and optimize your system’s uptime and performance.
Our worldwide team of 1,000 service professionals is ready to assist you with technical issues or other service inquiries. Their goal is to expediently resolve any issue that might arise with your instrument.
Frequently asked questions
The Thermo Scientific Helios 6 HX FIB-SEM is intended for semiconductor manufacturers that require high-throughput, high-quality TEM sample preparation. It is particularly well suited for advanced node failure analysis, process control, reference metrology, and other environments where automation, repeatability, and productivity are essential.
As semiconductor devices continue to shrink and device architectures become more complex, laboratories need to prepare increasingly thin TEM samples while maintaining throughput and consistency. The Thermo Scientific Helios 6 HX FIB-SEM addresses these challenges through automated navigation, AI-enabled endpointing and workflow optimization, as well as a range of hardware designed to improve precision and reduce operator intervention.
The Thermo Scientific Helios 6 HX FIB-SEM is designed to minimize manual intervention throughout the sample preparation process. Automated positioning and thinning, along with integrated software workflows and improved hardware stability, enable semiconductor laboratories to produce more consistent, high-quality TEM samples.
The combination of robust workflows, improved positioning accuracy, and AI-assisted automation helps you increase throughput while maintaining consistent sample quality. With the Thermo Scientific Helios 6 HX FIB-SEM, your organization can scale TEM sample preparation as semiconductor manufacturing requirements continue to evolve.
The Thermo Scientific Helios 6 HX FIB-SEM builds on the automation, imaging, and sample preparation capabilities established by earlier Helios DualBeam systems. Previous Helios platforms combined high-resolution SEM imaging, advanced low-kV FIB milling, automated sample handling, and workflow automation to support TEM sample preparation. The Helios 6 HX FIB-SEM extends these capabilities with AI-assisted endpointing, improved FIB hardware, enhanced digital scanning, and production-focused workflow improvements.
Yes, the Thermo Scientific Helios 6 HX FIB-SEM is designed to accurately produce sub-20 nm TEM lamellae.
In the Thermo Scientific Helios 6 HX FIB-SEM, artificial intelligence supports automated endpointing during thinning and can be used to train automation models for the preparation of specific semiconductor sample types. This helps improve consistency while allowing workflows to be adapted to evolving manufacturing technologies and needs.
For Research Use Only. Not for use in diagnostic procedures.