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Revolutionary advancements in 2.5D and 3D packaging, sophisticated interconnect architectures, and next-generation power devices present unprecedented challenges in semiconductor failure analysis. As devices become smaller yet more complex, defects typically manifest as anomalous local power dissipation, creating subtle thermal signatures that are critical to identifying underlying issues.
The Thermo Scientific ELITE System is a precision fault isolation platform that delivers rapid, non-destructive defect localization through advanced IR lock-in thermography. It can detect defects with high sensitivity enabled by patented noise suppression mechanisms and has the flexibility to combine high-resolution IR imaging with laser scanning microscopy to provide excellent detection accuracy, enabling faster root cause analysis.
For Research Use Only. Not for use in diagnostic procedures.