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Helios 5 PFIB DualBeam

High-throughput plasma FIB for fast, gallium-free results.

The Thermo Scientific Helios 5 PFIB DualBeam combines a high-current xenon plasma FIB (PFIB) with advanced SEM imaging to deliver fast, large-scale milling and subsurface analysis. Designed for users who need fast, precise, and gallium-free workflows, it offers a strong balance of throughput and precision. From rapid excavation of large structures and contamination-free TEM lamella preparation, to precise planar deprocessing of nanoscale semiconductor devices, the Helios 5 PFIB ensures accurate, reproducible results across demanding applications in materials science and semiconductor analysis.

Helios 5 PFIB DualBeam features

Faster, larger cuts

High-current, 2.5-μA, xenon PFIB for rapid material removal.

Gallium-free sample prep

Plasma ions prevent gallium implantation in sensitive samples.

Reveal the fine details

Enabled by sub-nanometer SEM performance, even at low energies.

Atomic detail

Low-kV polishing minimizes damage for TEM sample prep.

Advanced automated workflows

Gain exceptional insights with consistent quality.

Reveal with precision

Automated, layer-by-layer, planar removal of nanometer-scale metallic interconnects.

For Research Use Only. Not for use in diagnostic procedures.