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FIB-SEM solutions for sample preparation and analysis
Our DualBeam FIB-SEM systems empower a variety of advanced techniques that enable researchers to prepare samples and gather data in ways not possible with conventional microscopes. This page highlights the core techniques and workflows facilitated by our instruments, explaining what they are and why they matter for your research. Whether your goal is to create an ultrathin TEM lamella or to reconstruct a 3D volume of your sample’s interior, our FIB-SEM solutions provide the tools and automation to get it done efficiently.
S/TEM sample preparation
The Helios 5 PFIB DualBeam enables fast and easy preparation of high-quality, gallium-free TEM samples for various materials, minimizing surface damage on lamellae of sensitive samples such as Al alloys. Polishing with low-energy ions ensures high-quality results of complex samples.
3D structural analysis and characterization
Revealing and characterizing buried features and the development of advanced materials often require multi-scale 3D analysis. The Helios 5 PFIB DualBeam enables high-throughput and precise serial sectioning of large volumes with subsequent SEM imaging and analytical characterization at nanometer scale. This data can be processed using Thermo Scientific Avizo Software into high-quality 3D reconstructions of the structures and defects of interest.
Automated, planar delayering
The combination of Dx delayering chemistry, Xe ion plasma FIB, and the advanced Helios 5+ PFIB DualBeam’s Damage Free Delayering Package that enables ultra-low-kV, 100 eV SEM inspection enables automated and exceptional insights across multiple sample regions for inspection and defect analysis of semiconductor devices.
Cross-sectioning (2D)
Cross-sectioning provides insight by revealing sub-surface information. A high-current Xe beam enables rapid excavation of large areas while preserving detail. With automation, unattended high-throughput processing of samples is also possible. Ideal for electronics packaging, metals, and geology.
Nanoprototyping and nanofabrication
The xenon plasma FIB is particularly advantageous for large-scale prototyping due to its efficient volume removal capabilities. This makes it ideal for applications such as structural modifications and patterning.
Cryo workflow
Enables TEM sample preparation, 3D analysis, or cross-sectioning at cryogenic temperatures to preserve samples in their native state. This is critical for sensitive materials such as lithium batteries or polymers. The plasma FIB also enables large-area cryo cross-sections.
APT tip preparation
Atom probe tomography (APT) provides atomic-resolution 3D compositional analysis of materials. Focused ion beam scanning electron microscopy (FIB-SEM) is an essential technique for high-quality, orientation, and site-specific sample preparation for APT characterization. The Helios 5 PFIB DualBeam enhances preparation quality by providing a gallium-free workflow, preserving material structure and composition, making it an excellent choice for material analysis requiring contamination-free samples.
For Research Use Only. Not for use in diagnostic procedures.